AFS600-2FGG484I
For Reference Only
| Part Number | AFS600-2FGG484I |
| PNEDA Part # | AFS600-2FGG484I |
| Description | IC FPGA 172 I/O 484FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 8,604 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 7 - Jun 12 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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AFS600-2FGG484I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | AFS600-2FGG484I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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Logistics Mode
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AFS600-2FGG484I Specifications
| Manufacturer | Microsemi Corporation |
| Series | Fusion® |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 110592 |
| Number of I/O | 172 |
| Number of Gates | 600000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 484-BGA |
| Supplier Device Package | 484-FPBGA (23x23) |
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Manufacturer Intel Series FLEX-10K® Number of LABs/CLBs 288 Number of Logic Elements/Cells 2304 Total RAM Bits 16384 Number of I/O 189 Number of Gates 93000 Voltage - Supply 4.75V ~ 5.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 240-BFQFP Exposed Pad Supplier Device Package 240-RQFP (32x32) |
