DSPIC33EP128GS702-E/MM
For Reference Only
| Part Number | DSPIC33EP128GS702-E/MM |
| PNEDA Part # | DSPIC33EP128GS702-E-MM |
| Description | IC MCU 16BIT 128KB FLASH 28QFN |
| Manufacturer | Microchip Technology |
| Unit Price | Request a Quote |
| In Stock | 3,528 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Nov 3 - Nov 8 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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DSPIC33EP128GS702-E/MM Resources
| Brand | Microchip Technology |
| ECAD Module |
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| Mfr. Part Number | DSPIC33EP128GS702-E/MM |
| Category | Semiconductors › Embedded Processors & Controllers › Microcontrollers |
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DSPIC33EP128GS702-E/MM Specifications
| Manufacturer | Microchip Technology |
| Series | Automotive, AEC-Q100, dsPIC™ 33EP |
| Core Processor | dsPIC |
| Core Size | 16-Bit |
| Speed | 60 MIPs |
| Connectivity | I²C, IrDA, LINbus, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, I²S, POR, PWM, WDT |
| Number of I/O | 20 |
| Program Memory Size | 128KB (43K x 24) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 8K x 8 |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V |
| Data Converters | A/D 11x12b; D/A 1x12b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 28-VQFN Exposed Pad |
| Supplier Device Package | 28-QFN-S (6x6) |
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Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 1.5KB (1.5K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 4x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 16-SOIC (0.295", 7.50mm Width) Supplier Device Package 16-SOIC |
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