EP20K60EBC356-3
For Reference Only
| Part Number | EP20K60EBC356-3 |
| PNEDA Part # | EP20K60EBC356-3 |
| Description | IC FPGA 196 I/O 356BGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 4,716 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 11 - Jun 16 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP20K60EBC356-3 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP20K60EBC356-3 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP20K60EBC356-3 Specifications
| Manufacturer | Intel |
| Series | APEX-20KE® |
| Number of LABs/CLBs | 2560 |
| Number of Logic Elements/Cells | 2560 |
| Total RAM Bits | 32768 |
| Number of I/O | 196 |
| Number of Gates | 162000 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 356-LBGA |
| Supplier Device Package | 356-BGA (35x35) |
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Manufacturer Intel Series APEX-20KE® Number of LABs/CLBs 5184 Number of Logic Elements/Cells 51840 Total RAM Bits 442368 Number of I/O 808 Number of Gates 2392000 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 1020-BBGA Supplier Device Package 1020-FBGA (33x33) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 252 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
Manufacturer Microsemi Corporation Series MX Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 2560 Number of I/O 202 Number of Gates 54000 Voltage - Supply 3V ~ 3.6V, 4.75V ~ 5.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 240-BFQFP Supplier Device Package 240-PQFP (32x32) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 4704 Number of Logic Elements/Cells 21168 Total RAM Bits 1146880 Number of I/O 556 Number of Gates 254016 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 900-BBGA Supplier Device Package 900-FBGA (31x31) |
Manufacturer Lattice Semiconductor Corporation Series XP Number of LABs/CLBs - Number of Logic Elements/Cells 15000 Total RAM Bits 331776 Number of I/O 188 Number of Gates - Voltage - Supply 1.71V ~ 3.465V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-BGA Supplier Device Package 256-FPBGA (17x17) |
