EP3C25E144I7
For Reference Only
| Part Number | EP3C25E144I7 |
| PNEDA Part # | EP3C25E144I7 |
| Description | IC FPGA 82 I/O 144EQFP |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 2,376 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 21 - Jun 26 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP3C25E144I7 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP3C25E144I7 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP3C25E144I7 Specifications
| Manufacturer | Intel |
| Series | Cyclone® III |
| Number of LABs/CLBs | 1539 |
| Number of Logic Elements/Cells | 24624 |
| Total RAM Bits | 608256 |
| Number of I/O | 82 |
| Number of Gates | - |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 144-LQFP Exposed Pad |
| Supplier Device Package | 144-EQFP (20x20) |
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Manufacturer Intel Series Cyclone® 10 LP Number of LABs/CLBs 3491 Number of Logic Elements/Cells 55856 Total RAM Bits 2396160 Number of I/O 321 Number of Gates - Voltage - Supply 1.0V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-FBGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Microsemi Corporation Series ProASIC3 Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 55296 Number of I/O 194 Number of Gates 400000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
Manufacturer Microsemi Corporation Series ProASIC3 nano Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 36864 Number of I/O 68 Number of Gates 250000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -20°C ~ 85°C (TJ) Package / Case 100-TQFP Supplier Device Package 100-VQFP (14x14) |
