W25Q80BVSNIG
For Reference Only
| Part Number | W25Q80BVSNIG |
| PNEDA Part # | W25Q80BVSNIG |
| Description | IC FLASH 8M SPI 104MHZ 8SOIC |
| Manufacturer | Winbond Electronics |
| Unit Price | Request a Quote |
| In Stock | 95,687 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 13 - Jun 18 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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W25Q80BVSNIG Resources
| Brand | Winbond Electronics |
| ECAD Module |
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| Mfr. Part Number | W25Q80BVSNIG |
| Category | Semiconductors › Memory ICs › Memory |
| Datasheet |
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- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
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- Orders cannot be canceled after shipping the packages.
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W25Q80BVSNIG Specifications
| Manufacturer | Winbond Electronics |
| Series | SpiFlash® |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 8Mb (1M x 8) |
| Memory Interface | SPI |
| Clock Frequency | 104MHz |
| Write Cycle Time - Word, Page | 3ms |
| Access Time | - |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| Supplier Device Package | 8-SOIC |
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Manufacturer Cypress Semiconductor Corp Series GL-S Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NOR Memory Size 128Mb (8M x 16) Memory Interface Parallel Clock Frequency - Write Cycle Time - Word, Page 60ns Access Time 100ns Voltage - Supply 1.65V ~ 3.6V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 64-LBGA Supplier Device Package 64-FBGA (13x11) |
