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XCZU4CG-L1FBVB900I

XCZU4CG-L1FBVB900I

For Reference Only

Part Number XCZU4CG-L1FBVB900I
PNEDA Part # XCZU4CG-L1FBVB900I
Description IC SOC CORTEX-A53 900FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 3,204
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 23 - May 28 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU4CG-L1FBVB900I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU4CG-L1FBVB900I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU4CG-L1FBVB900I, XCZU4CG-L1FBVB900I Datasheet (Total Pages: 102, Size: 2,181.63 KB)
PDFXCZU19EG-3FFVD1760E Datasheet Cover
XCZU19EG-3FFVD1760E Datasheet Page 2 XCZU19EG-3FFVD1760E Datasheet Page 3 XCZU19EG-3FFVD1760E Datasheet Page 4 XCZU19EG-3FFVD1760E Datasheet Page 5 XCZU19EG-3FFVD1760E Datasheet Page 6 XCZU19EG-3FFVD1760E Datasheet Page 7 XCZU19EG-3FFVD1760E Datasheet Page 8 XCZU19EG-3FFVD1760E Datasheet Page 9 XCZU19EG-3FFVD1760E Datasheet Page 10 XCZU19EG-3FFVD1760E Datasheet Page 11

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XCZU4CG-L1FBVB900I Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC CG
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed500MHz, 1.2GHz
Primary AttributesZynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)

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