Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XCZU4CG-L1FBVB900I

XCZU4CG-L1FBVB900I

For Reference Only

Part Number XCZU4CG-L1FBVB900I
PNEDA Part # XCZU4CG-L1FBVB900I
Description IC SOC CORTEX-A53 900FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 3,204
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Apr 29 - May 4 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU4CG-L1FBVB900I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU4CG-L1FBVB900I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU4CG-L1FBVB900I, XCZU4CG-L1FBVB900I Datasheet (Total Pages: 102, Size: 2,181.63 KB)
PDFXCZU19EG-3FFVD1760E Datasheet Cover
XCZU19EG-3FFVD1760E Datasheet Page 2 XCZU19EG-3FFVD1760E Datasheet Page 3 XCZU19EG-3FFVD1760E Datasheet Page 4 XCZU19EG-3FFVD1760E Datasheet Page 5 XCZU19EG-3FFVD1760E Datasheet Page 6 XCZU19EG-3FFVD1760E Datasheet Page 7 XCZU19EG-3FFVD1760E Datasheet Page 8 XCZU19EG-3FFVD1760E Datasheet Page 9 XCZU19EG-3FFVD1760E Datasheet Page 10 XCZU19EG-3FFVD1760E Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XCZU4CG-L1FBVB900I Datasheet
  • where to find XCZU4CG-L1FBVB900I
  • Xilinx

  • Xilinx XCZU4CG-L1FBVB900I
  • XCZU4CG-L1FBVB900I PDF Datasheet
  • XCZU4CG-L1FBVB900I Stock

  • XCZU4CG-L1FBVB900I Pinout
  • Datasheet XCZU4CG-L1FBVB900I
  • XCZU4CG-L1FBVB900I Supplier

  • Xilinx Distributor
  • XCZU4CG-L1FBVB900I Price
  • XCZU4CG-L1FBVB900I Distributor

XCZU4CG-L1FBVB900I Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC CG
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed500MHz, 1.2GHz
Primary AttributesZynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case900-BBGA, FCBGA
Supplier Device Package900-FCBGA (31x31)

The Products You May Be Interested In

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC CG

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

625-BFBGA, FCBGA

Supplier Device Package

625-FCBGA (21x21)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

FPGA - 480K Logic Elements

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FBGA, FC (35x35)

M2S050TS-VFG400I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 50K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

400-LFBGA

Supplier Device Package

400-VFBGA (17x17)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 600MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

M2S090TS-1FG676I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

512KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 90K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

676-BGA

Supplier Device Package

676-FBGA (27x27)

Recently Sold

MBR360G

MBR360G

ON Semiconductor

DIODE SCHOTTKY 60V 3A DO201AD

EP53A8LQI

EP53A8LQI

Intel

DC DC CONVERTER 0.6-5V 5W

2EDN7424FXTMA1

2EDN7424FXTMA1

Infineon Technologies

IC GATE DRIVER DSO8

766161102GPTR13

766161102GPTR13

CTS Resistor Products

RES ARRAY 15 RES 1K OHM 16SOIC

ACPL-064L-500E

ACPL-064L-500E

Broadcom

OPTOISO 3.75KV 2CH PUSH PULL 8SO

XC7Z030-1FBG676I

XC7Z030-1FBG676I

Xilinx

IC SOC CORTEX-A9 667MHZ 676FCBGA

0154002.DRT

0154002.DRT

Littelfuse

FUSE BOARD MNT 2A 125VAC/VDC SMD

NC7WZ04P6X

NC7WZ04P6X

ON Semiconductor

IC INVERTER 2CH 2-INP SC70-6

SMAJ6.0A

SMAJ6.0A

Bourns

TVS DIODE 6V 10.3V SMA

AD7870JP

AD7870JP

Analog Devices

IC ADC 12BIT SAR 28PLCC

HSMS-A100-J00J1

HSMS-A100-J00J1

Broadcom

LED RED CLEAR 2PLCC SMD

MC100ELT22DG

MC100ELT22DG

ON Semiconductor

IC TRNSLTR UNIDIRECTIONAL 8SOIC