DS34S132GN Datasheet
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Manufacturer Maxim Integrated Series - Function TDM-over-Packet (TDMoP) Interface TDMoP Number of Circuits 1 Voltage - Supply 1.8V, 3.3V Current - Supply - Power (Watts) - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 676-BGA Supplier Device Package 676-TEPBGA (27x27) |
Manufacturer Maxim Integrated Series - Function TDM-over-Packet (TDMoP) Interface TDMoP Number of Circuits 1 Voltage - Supply 1.8V, 3.3V Current - Supply - Power (Watts) - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 676-BGA Supplier Device Package 676-TEPBGA (27x27) |
Manufacturer Maxim Integrated Series - Function TDM-over-Packet (TDMoP) Interface TDMoP Number of Circuits 1 Voltage - Supply 1.8V, 3.3V Current - Supply - Power (Watts) - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 676-BGA Supplier Device Package 676-TEPBGA (27x27) |
