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LPC18S50FET256 Datasheet

LPC18S50FET256 Datasheet
Total Pages: 152
Size: 6,904.5 KB
NXP
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Manufacturer

NXP USA Inc.

Series

LPC18xx

Core Processor

ARM® Cortex®-M3

Core Size

32-Bit

Speed

180MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB

Peripherals

Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT

Number of I/O

164

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

200K x 8

Voltage - Supply (Vcc/Vdd)

2.2V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

256-LBGA

Supplier Device Package

256-LBGA (17x17)

Manufacturer

NXP USA Inc.

Series

LPC18xx

Core Processor

ARM® Cortex®-M3

Core Size

32-Bit

Speed

180MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB

Peripherals

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT

Number of I/O

164

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

200K x 8

Voltage - Supply (Vcc/Vdd)

2.2V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

256-LBGA

Supplier Device Package

256-LBGA (17x17)

Manufacturer

NXP USA Inc.

Series

LPC18xx

Core Processor

ARM® Cortex®-M3

Core Size

32-Bit

Speed

180MHz

Connectivity

CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT

Number of I/O

83

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

136K x 8

Voltage - Supply (Vcc/Vdd)

2.2V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

144-LQFP

Supplier Device Package

144-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

LPC18xx

Core Processor

ARM® Cortex®-M3

Core Size

32-Bit

Speed

180MHz

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB

Peripherals

Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT

Number of I/O

118

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

200K x 8

Voltage - Supply (Vcc/Vdd)

2.2V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

180-TFBGA

Supplier Device Package

180-TFBGA (12x12)

Manufacturer

NXP USA Inc.

Series

LPC18xx

Core Processor

ARM® Cortex®-M3

Core Size

32-Bit

Speed

180MHz

Connectivity

CANbus, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, DMA, I²S, POR, WDT

Number of I/O

49

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

136K x 8

Voltage - Supply (Vcc/Vdd)

2.2V ~ 3.6V

Data Converters

A/D 4x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

100-TFBGA

Supplier Device Package

100-TFBGA (9x9)