MC33PF8200DGES Datasheet
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Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount, Wettable Flank Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount, Wettable Flank Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount, Wettable Flank Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
Manufacturer NXP USA Inc. Series - Applications High Performance i.MX 8, S32x Processor Based Current - Supply - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount, Wettable Flank Package / Case 56-VFQFN Exposed Pad Supplier Device Package 56-HVQFN (8x8) |
