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MC33PF8200ETES Datasheet

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Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.7V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.7V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.5V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.5V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.5V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.5V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.5V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.5V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.7V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.7V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.7V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)

Manufacturer

NXP USA Inc.

Series

-

Applications

High Performance i.MX 8, S32x Processor Based

Current - Supply

-

Voltage - Supply

2.7V ~ 5.5V

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount, Wettable Flank

Package / Case

56-VFQFN Exposed Pad

Supplier Device Package

56-HVQFN (8x8)