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MC908QL4MDTER Datasheet

MC908QL4MDTER Datasheet
Total Pages: 226
Size: 3,778.42 KB
NXP
This datasheet covers 5 part numbers: MC908QL4MDTER, MC908QL4MDWE, MC908QL4MDTE, MC908QL4MDT, MC908QL4MDW
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Manufacturer

NXP USA Inc.

Series

HC08

Core Processor

HC08

Core Size

8-Bit

Speed

8MHz

Connectivity

LINbus

Peripherals

LVD, POR, PWM

Number of I/O

13

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 6x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

16-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

16-TSSOP

Manufacturer

NXP USA Inc.

Series

HC08

Core Processor

HC08

Core Size

8-Bit

Speed

8MHz

Connectivity

LINbus

Peripherals

LVD, POR, PWM

Number of I/O

13

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 6x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

16-SOIC (0.295", 7.50mm Width)

Supplier Device Package

16-SOIC

Manufacturer

NXP USA Inc.

Series

HC08

Core Processor

HC08

Core Size

8-Bit

Speed

8MHz

Connectivity

LINbus

Peripherals

LVD, POR, PWM

Number of I/O

13

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 6x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

16-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

16-TSSOP

Manufacturer

NXP USA Inc.

Series

HC08

Core Processor

HC08

Core Size

8-Bit

Speed

8MHz

Connectivity

LINbus

Peripherals

LVD, POR, PWM

Number of I/O

13

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 6x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

16-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

16-TSSOP

Manufacturer

NXP USA Inc.

Series

HC08

Core Processor

HC08

Core Size

8-Bit

Speed

8MHz

Connectivity

LINbus

Peripherals

LVD, POR, PWM

Number of I/O

13

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 6x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

16-SOIC (0.295", 7.50mm Width)

Supplier Device Package

16-SOIC