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MC9S08QA2CPAE Datasheet

MC9S08QA2CPAE Datasheet
Total Pages: 200
Size: 3,116.3 KB
NXP
This datasheet covers 3 part numbers: MC9S08QA2CPAE, MC9S08QA2CFQE, MC9S08QA2CDNE
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Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

-

Peripherals

LVD, POR, PWM, WDT

Number of I/O

4

Program Memory Size

2KB (2K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

160 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 4x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

8-DIP (0.300", 7.62mm)

Supplier Device Package

8-PDIP

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

-

Peripherals

LVD, POR, PWM, WDT

Number of I/O

4

Program Memory Size

2KB (2K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

160 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 4x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

8-VDFN Exposed Pad

Supplier Device Package

8-DFN-EP (4x4)

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

-

Peripherals

LVD, POR, PWM, WDT

Number of I/O

4

Program Memory Size

2KB (2K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

160 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 4x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154", 3.90mm Width)

Supplier Device Package

8-SOIC