MCF5329CVM240J Datasheet
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Manufacturer NXP USA Inc. Series MCF532x Core Processor Coldfire V3 Core Size 32-Bit Speed 240MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG Peripherals DMA, LCD, PWM, WDT Number of I/O 94 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V Data Converters - Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPBGA (17x17) |
Manufacturer NXP USA Inc. Series MCF532x Core Processor Coldfire V3 Core Size 32-Bit Speed 240MHz Connectivity EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG Peripherals DMA, LCD, PWM, WDT Number of I/O 94 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V Data Converters - Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPBGA (17x17) |
Manufacturer NXP USA Inc. Series MCF532x Core Processor Coldfire V3 Core Size 32-Bit Speed 240MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG Peripherals DMA, LCD, PWM, WDT Number of I/O 94 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V Data Converters - Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPBGA (17x17) |
Manufacturer NXP USA Inc. Series MCF532x Core Processor Coldfire V3 Core Size 32-Bit Speed 240MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG Peripherals DMA, LCD, PWM, WDT Number of I/O 94 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V Data Converters - Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPBGA (17x17) |
Manufacturer NXP USA Inc. Series MCF532x Core Processor Coldfire V3 Core Size 32-Bit Speed 240MHz Connectivity EBI/EMI, I²C, SPI, SSI, UART/USART, USB, USB OTG Peripherals DMA, LCD, PWM, WDT Number of I/O 94 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V Data Converters - Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 196-LBGA Supplier Device Package 196-MAPBGA (15x15) |
Manufacturer NXP USA Inc. Series MCF532x Core Processor Coldfire V3 Core Size 32-Bit Speed 240MHz Connectivity EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG Peripherals DMA, LCD, PWM, WDT Number of I/O 94 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V Data Converters - Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPBGA (17x17) |
Manufacturer NXP USA Inc. Series MCF532x Core Processor Coldfire V3 Core Size 32-Bit Speed 240MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG Peripherals DMA, LCD, PWM, WDT Number of I/O 94 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V Data Converters - Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPBGA (17x17) |
