MK65FN2M0CAC18R Datasheet
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Manufacturer NXP USA Inc. Series Kinetis K60 Core Processor ARM® Cortex®-M4 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals DMA, I²S, LVD, POR, PWM, WDT Number of I/O 116 Program Memory Size 2MB (2M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 2x16b; D/A 2x12b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 169-UFBGA, WLCSP Supplier Device Package 169-WLCSP (5.5x5.63) |
Manufacturer NXP USA Inc. Series Kinetis K60 Core Processor ARM® Cortex®-M4 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals DMA, I²S, LVD, POR, PWM, WDT Number of I/O 116 Program Memory Size 1MB (1M x 8) Program Memory Type FLASH EEPROM Size 4K x 8 RAM Size 256K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 2x16b; D/A 2x12b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 169-UFBGA, WLCSP Supplier Device Package 169-WLCSP (5.5x5.63) |
