SPC5775EDK3MME3R Datasheet
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Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Dual-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O 293 Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 40x12b eQADCx2 Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Dual-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O 293 Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 40x12b eQADCx2 Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Dual-Core Speed 220MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O 293 Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 40x12b eQADCx2 Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
