XAZU3EG-1SFVC784Q Datasheet
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Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.8MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature -40°C ~ 125°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.8MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature -40°C ~ 125°C (TJ) Package / Case 625-BFBGA, FCBGA Supplier Device Package 625-FCBGA (21x21) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.2MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature -40°C ~ 125°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.2MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature -40°C ~ 125°C (TJ) Package / Case 484-BFBGA, FCBGA Supplier Device Package 484-FCBGA (19x19) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.2MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature -40°C ~ 125°C (TJ) Package / Case 625-BFBGA, FCBGA Supplier Device Package 625-FCBGA (21x21) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.8MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 625-BFBGA, FCBGA Supplier Device Package 625-FCBGA (21x21) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.2MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.8MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.8MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 625-BFBGA, FCBGA Supplier Device Package 625-FCBGA (21x21) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.2MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.2MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 625-BFBGA, FCBGA Supplier Device Package 625-FCBGA (21x21) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MPU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 1.2MB Peripherals DMA, WDT Connectivity CANbus, I²C, SPI, UART/USART, USB Speed 500MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 625-BFBGA, FCBGA Supplier Device Package 625-FCBGA (21x21) |
