XCV812E-8FG900C Datasheet
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Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 4704 Number of Logic Elements/Cells 21168 Total RAM Bits 1146880 Number of I/O 556 Number of Gates 254016 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 900-BBGA Supplier Device Package 900-FBGA (31x31) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 4704 Number of Logic Elements/Cells 21168 Total RAM Bits 1146880 Number of I/O 404 Number of Gates 254016 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 4704 Number of Logic Elements/Cells 21168 Total RAM Bits 1146880 Number of I/O 556 Number of Gates 254016 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 900-BBGA Supplier Device Package 900-FBGA (31x31) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 4704 Number of Logic Elements/Cells 21168 Total RAM Bits 1146880 Number of I/O 404 Number of Gates 254016 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 4704 Number of Logic Elements/Cells 21168 Total RAM Bits 1146880 Number of I/O 556 Number of Gates 254016 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 900-BBGA Supplier Device Package 900-FBGA (31x31) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 4704 Number of Logic Elements/Cells 21168 Total RAM Bits 1146880 Number of I/O 404 Number of Gates 254016 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 573440 Number of I/O 404 Number of Gates 129600 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 573440 Number of I/O 404 Number of Gates 129600 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 573440 Number of I/O 404 Number of Gates 129600 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 573440 Number of I/O 404 Number of Gates 129600 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 573440 Number of I/O 404 Number of Gates 129600 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series Virtex®-E EM Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 573440 Number of I/O 404 Number of Gates 129600 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
