10AS032H2F34I2LG
For Reference Only
| Part Number | 10AS032H2F34I2LG |
| PNEDA Part # | 10AS032H2F34I2LG |
| Description | IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 6,354 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 19 - May 24 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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10AS032H2F34I2LG Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | 10AS032H2F34I2LG |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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10AS032H2F34I2LG Specifications
| Manufacturer | Intel |
| Series | Arria 10 SX |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1.5GHz |
| Primary Attributes | FPGA - 320K Logic Elements |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA, FC (35x35) |
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Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 220K Logic Elements Operating Temperature -40°C ~ 100°C (TJ) Package / Case 672-BBGA, FCBGA Supplier Device Package 672-FBGA, FC (27x27) |
Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 660K Logic Elements Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FBGA, FC (35x35) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 10K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 90K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
