5CSEBA6U19A7N
For Reference Only
| Part Number | 5CSEBA6U19A7N |
| PNEDA Part # | 5CSEBA6U19A7N |
| Description | IC SOC CORTEX-A9 700MHZ 484UBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 3,366 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 3 - May 8 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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5CSEBA6U19A7N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | 5CSEBA6U19A7N |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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5CSEBA6U19A7N Specifications
| Manufacturer | Intel |
| Series | Automotive, AEC-Q100, Cyclone® V SE |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| RAM Size | 64KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 700MHz |
| Primary Attributes | FPGA - 110K Logic Elements |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Package / Case | 484-FBGA |
| Supplier Device Package | 484-UBGA (19x19) |
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Manufacturer Intel Series Automotive, AEC-Q100, Cyclone® V SE Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 700MHz Primary Attributes FPGA - 25K Logic Elements Operating Temperature -40°C ~ 125°C (TJ) Package / Case 484-FBGA Supplier Device Package 484-UBGA (19x19) |
Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 160K Logic Elements Operating Temperature 0°C ~ 100°C (TJ) Package / Case 484-BFBGA Supplier Device Package 484-UBGA (19x19) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 600MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 900-BBGA, FCBGA Supplier Device Package 900-FCBGA (31x31) |
Manufacturer Intel Series Arria 10 SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 320K Logic Elements Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FBGA, FC (35x35) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 64KB Peripherals DDR Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 5K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
