5SGXEA7H3F35C2N
For Reference Only
| Part Number | 5SGXEA7H3F35C2N |
| PNEDA Part # | 5SGXEA7H3F35C2N |
| Description | IC FPGA 552 I/O 1152FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 3,438 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 29 - May 4 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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5SGXEA7H3F35C2N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | 5SGXEA7H3F35C2N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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5SGXEA7H3F35C2N Specifications
| Manufacturer | Intel |
| Series | Stratix® V GX |
| Number of LABs/CLBs | 234720 |
| Number of Logic Elements/Cells | 622000 |
| Total RAM Bits | 59939840 |
| Number of I/O | 552 |
| Number of Gates | - |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
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Manufacturer Intel Series FLEX-10KE® Number of LABs/CLBs 624 Number of Logic Elements/Cells 4992 Total RAM Bits 49152 Number of I/O 191 Number of Gates 257000 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 256-BGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Microsemi Corporation Series MX Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits - Number of I/O 150 Number of Gates 36000 Voltage - Supply 3V ~ 3.6V, 4.5V ~ 5.5V Mounting Type Surface Mount Operating Temperature -55°C ~ 125°C (TC) Package / Case 176-LQFP Supplier Device Package 176-TQFP (24x24) |
Manufacturer Intel Series Stratix® V GX Number of LABs/CLBs 225400 Number of Logic Elements/Cells 597000 Total RAM Bits 61688832 Number of I/O 600 Number of Gates - Voltage - Supply 0.82V ~ 0.88V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FBGA, FC (42.5x42.5) |
Manufacturer Microsemi Corporation Series MX Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 2560 Number of I/O 202 Number of Gates 54000 Voltage - Supply 3V ~ 3.6V, 4.5V ~ 5.5V Mounting Type Surface Mount Operating Temperature -40°C ~ 85°C (TA) Package / Case 272-BBGA Supplier Device Package 272-PBGA (27x27) |
Manufacturer Xilinx Inc. Series Kintex®-7 Number of LABs/CLBs 25475 Number of Logic Elements/Cells 326080 Total RAM Bits 16404480 Number of I/O 400 Number of Gates - Voltage - Supply 0.97V ~ 1.03V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA (27x27) |
