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5SGXMA3H1F35C2LN

5SGXMA3H1F35C2LN

For Reference Only

Part Number 5SGXMA3H1F35C2LN
PNEDA Part # 5SGXMA3H1F35C2LN
Description IC FPGA 432 I/O 1152FBGA
Manufacturer Intel
Unit Price Request a Quote
In Stock 2,808
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 16 - Jun 21 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

5SGXMA3H1F35C2LN Resources

Brand Intel
ECAD Module ECAD
Mfr. Part Number5SGXMA3H1F35C2LN
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)
Datasheet
5SGXMA3H1F35C2LN, 5SGXMA3H1F35C2LN Datasheet (Total Pages: 72, Size: 2,024.93 KB)
PDF5SGTMC7K3F40I2N Datasheet Cover
5SGTMC7K3F40I2N Datasheet Page 2 5SGTMC7K3F40I2N Datasheet Page 3 5SGTMC7K3F40I2N Datasheet Page 4 5SGTMC7K3F40I2N Datasheet Page 5 5SGTMC7K3F40I2N Datasheet Page 6 5SGTMC7K3F40I2N Datasheet Page 7 5SGTMC7K3F40I2N Datasheet Page 8 5SGTMC7K3F40I2N Datasheet Page 9 5SGTMC7K3F40I2N Datasheet Page 10 5SGTMC7K3F40I2N Datasheet Page 11

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5SGXMA3H1F35C2LN Specifications

ManufacturerIntel
SeriesStratix® V GX
Number of LABs/CLBs128300
Number of Logic Elements/Cells340000
Total RAM Bits23704576
Number of I/O432
Number of Gates-
Voltage - Supply0.82V ~ 0.88V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)

The Products You May Be Interested In

Manufacturer

Intel

Series

Stratix® V GX

Number of LABs/CLBs

158500

Number of Logic Elements/Cells

420000

Total RAM Bits

43983872

Number of I/O

552

Number of Gates

-

Voltage - Supply

0.82V ~ 0.88V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FBGA (35x35)

LFE3-70EA-7FN484I

Lattice Semiconductor Corporation

Manufacturer

Lattice Semiconductor Corporation

Series

ECP3

Number of LABs/CLBs

8375

Number of Logic Elements/Cells

67000

Total RAM Bits

4526080

Number of I/O

295

Number of Gates

-

Voltage - Supply

1.14V ~ 1.26V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

484-BBGA

Supplier Device Package

484-FPBGA (23x23)

Manufacturer

Xilinx Inc.

Series

Virtex®

Number of LABs/CLBs

2400

Number of Logic Elements/Cells

10800

Total RAM Bits

81920

Number of I/O

316

Number of Gates

468252

Voltage - Supply

2.375V ~ 2.625V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

432-LBGA Exposed Pad, Metal

Supplier Device Package

432-MBGA (40x40)

M1AFS600-FGG256

Microsemi

Manufacturer

Microsemi Corporation

Series

Fusion®

Number of LABs/CLBs

-

Number of Logic Elements/Cells

-

Total RAM Bits

110592

Number of I/O

119

Number of Gates

600000

Voltage - Supply

1.425V ~ 1.575V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FPBGA (17x17)

A54SX16P-TQG176I

Microsemi

Manufacturer

Microsemi Corporation

Series

SX

Number of LABs/CLBs

1452

Number of Logic Elements/Cells

-

Total RAM Bits

-

Number of I/O

147

Number of Gates

24000

Voltage - Supply

3V ~ 3.6V, 4.75V ~ 5.25V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 85°C (TA)

Package / Case

176-LQFP

Supplier Device Package

176-TQFP (24x24)

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