5SGXMA3K2F35C3N
For Reference Only
| Part Number | 5SGXMA3K2F35C3N |
| PNEDA Part # | 5SGXMA3K2F35C3N |
| Description | IC FPGA 432 I/O 1152FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 7,416 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 8 - May 13 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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5SGXMA3K2F35C3N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | 5SGXMA3K2F35C3N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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5SGXMA3K2F35C3N Specifications
| Manufacturer | Intel |
| Series | Stratix® V GX |
| Number of LABs/CLBs | 128300 |
| Number of Logic Elements/Cells | 340000 |
| Total RAM Bits | 23704576 |
| Number of I/O | 432 |
| Number of Gates | - |
| Voltage - Supply | 0.82V ~ 0.88V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
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Manufacturer Intel Series Stratix® II Number of LABs/CLBs 4548 Number of Logic Elements/Cells 90960 Total RAM Bits 4520488 Number of I/O 902 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 1508-BBGA, FCBGA Supplier Device Package 1508-FBGA (30x30) |
Manufacturer Intel Series Cyclone® IV E Number of LABs/CLBs 392 Number of Logic Elements/Cells 6272 Total RAM Bits 276480 Number of I/O 179 Number of Gates - Voltage - Supply 0.97V ~ 1.03V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Xilinx Inc. Series Spartan®-3A Number of LABs/CLBs 2816 Number of Logic Elements/Cells 25344 Total RAM Bits 589824 Number of I/O 375 Number of Gates 1400000 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BBGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
