A3P250-1FGG256I
For Reference Only
| Part Number | A3P250-1FGG256I |
| PNEDA Part # | A3P250-1FGG256I |
| Description | IC FPGA 157 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 4,284 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 27 - Jul 2 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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A3P250-1FGG256I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | A3P250-1FGG256I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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A3P250-1FGG256I Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3 |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 36864 |
| Number of I/O | 157 |
| Number of Gates | 250000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Xilinx Inc. Series Kintex® UltraScale™ Number of LABs/CLBs 67200 Number of Logic Elements/Cells 1176000 Total RAM Bits 60518400 Number of I/O 702 Number of Gates - Voltage - Supply 0.922V ~ 0.979V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 2104-BBGA, FCBGA Supplier Device Package 2104-FCBGA (47.5x47.5) |
