A3P400-2FGG256I
For Reference Only
| Part Number | A3P400-2FGG256I |
| PNEDA Part # | A3P400-2FGG256I |
| Description | IC FPGA 178 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 8,046 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 17 - Jun 22 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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A3P400-2FGG256I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | A3P400-2FGG256I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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A3P400-2FGG256I Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3 |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 55296 |
| Number of I/O | 178 |
| Number of Gates | 400000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Xilinx Inc. Series Kintex®-7 Number of LABs/CLBs 31775 Number of Logic Elements/Cells 406720 Total RAM Bits 29306880 Number of I/O 500 Number of Gates - Voltage - Supply 0.97V ~ 1.03V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 900-BBGA, FCBGA Supplier Device Package 900-FCBGA (31x31) |
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Manufacturer Xilinx Inc. Series Virtex®-E Number of LABs/CLBs 7776 Number of Logic Elements/Cells 34992 Total RAM Bits 589824 Number of I/O 512 Number of Gates 2188742 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 680-LBGA Exposed Pad Supplier Device Package 680-FTEBGA (40x40) |
