A3P600L-1FGG144
For Reference Only
| Part Number | A3P600L-1FGG144 |
| PNEDA Part # | A3P600L-1FGG144 |
| Description | IC FPGA 97 I/O 144FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 8,748 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 17 - May 22 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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A3P600L-1FGG144 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | A3P600L-1FGG144 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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A3P600L-1FGG144 Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3L |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 110592 |
| Number of I/O | 97 |
| Number of Gates | 600000 |
| Voltage - Supply | 1.14V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 144-LBGA |
| Supplier Device Package | 144-FPBGA (13x13) |
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Manufacturer Xilinx Inc. Series Virtex®-E Number of LABs/CLBs 1536 Number of Logic Elements/Cells 6912 Total RAM Bits 131072 Number of I/O 158 Number of Gates 411955 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 240-BFQFP Supplier Device Package 240-PQFP (32x32) |
Manufacturer Microsemi Corporation Series IGLOO Number of LABs/CLBs - Number of Logic Elements/Cells 13824 Total RAM Bits 110592 Number of I/O 97 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 85°C (TA) Package / Case 144-LBGA Supplier Device Package 144-FPBGA (13x13) |
Manufacturer Intel Series Cyclone® Number of LABs/CLBs 598 Number of Logic Elements/Cells 5980 Total RAM Bits 92160 Number of I/O 185 Number of Gates - Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-BGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Xilinx Inc. Series Virtex® Number of LABs/CLBs 6144 Number of Logic Elements/Cells 27648 Total RAM Bits 131072 Number of I/O 404 Number of Gates 1124022 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
Manufacturer Intel Series FLEX-10KA® Number of LABs/CLBs 72 Number of Logic Elements/Cells 576 Total RAM Bits 6144 Number of I/O 134 Number of Gates 31000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
