APA300-FGG256
For Reference Only
| Part Number | APA300-FGG256 |
| PNEDA Part # | APA300-FGG256 |
| Description | IC FPGA 186 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 7,272 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 10 - May 15 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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APA300-FGG256 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | APA300-FGG256 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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APA300-FGG256 Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASICPLUS |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 73728 |
| Number of I/O | 186 |
| Number of Gates | 300000 |
| Voltage - Supply | 2.3V ~ 2.7V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Xilinx Inc. Series Virtex®-II Pro Number of LABs/CLBs 752 Number of Logic Elements/Cells 6768 Total RAM Bits 516096 Number of I/O 348 Number of Gates - Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 672-BBGA, FCBGA Supplier Device Package 672-FCBGA (27x27) |
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Manufacturer Microsemi Corporation Series ProASIC3 nano Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 36864 Number of I/O 71 Number of Gates 125000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -20°C ~ 85°C (TJ) Package / Case 100-TQFP Supplier Device Package 100-VQFP (14x14) |
