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CYV15G0402DXB-BGC

CYV15G0402DXB-BGC

For Reference Only

Part Number CYV15G0402DXB-BGC
PNEDA Part # CYV15G0402DXB-BGC
Description IC SERDES HOTLINK II 256LBGA
Manufacturer Cypress Semiconductor
Unit Price Request a Quote
In Stock 7,092
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 19 - Jun 24 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

CYV15G0402DXB-BGC Resources

Brand Cypress Semiconductor
ECAD Module ECAD
Mfr. Part NumberCYV15G0402DXB-BGC
CategorySemiconductorsInterface ICsInterface - Telecom
Datasheet
CYV15G0402DXB-BGC, CYV15G0402DXB-BGC Datasheet (Total Pages: 29, Size: 674.27 KB)
PDFCYV15G0402DXB-BGC Datasheet Cover
CYV15G0402DXB-BGC Datasheet Page 2 CYV15G0402DXB-BGC Datasheet Page 3 CYV15G0402DXB-BGC Datasheet Page 4 CYV15G0402DXB-BGC Datasheet Page 5 CYV15G0402DXB-BGC Datasheet Page 6 CYV15G0402DXB-BGC Datasheet Page 7 CYV15G0402DXB-BGC Datasheet Page 8 CYV15G0402DXB-BGC Datasheet Page 9 CYV15G0402DXB-BGC Datasheet Page 10 CYV15G0402DXB-BGC Datasheet Page 11

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CYV15G0402DXB-BGC Specifications

ManufacturerCypress Semiconductor Corp
SeriesHOTlink II™
Function-
InterfaceLVTTL
Number of Circuits4
Voltage - Supply3.135V ~ 3.465V
Current - Supply830mA
Power (Watts)-
Operating Temperature0°C ~ 70°C
Mounting TypeSurface Mount
Package / Case256-LBGA Exposed Pad
Supplier Device Package256-BGA (27x27)

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