Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

DSP56857BUE

DSP56857BUE

For Reference Only

Part Number DSP56857BUE
PNEDA Part # DSP56857BUE
Description IC MCU 16BIT 80KB SRAM 100LQFP
Manufacturer NXP
Unit Price Request a Quote
In Stock 8,640
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 20 - May 25 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

DSP56857BUE Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberDSP56857BUE
CategorySemiconductorsEmbedded Processors & ControllersMicrocontrollers
Datasheet
DSP56857BUE, DSP56857BUE Datasheet (Total Pages: 53, Size: 1,178.75 KB)
PDFDSP56857BUE Datasheet Cover
DSP56857BUE Datasheet Page 2 DSP56857BUE Datasheet Page 3 DSP56857BUE Datasheet Page 4 DSP56857BUE Datasheet Page 5 DSP56857BUE Datasheet Page 6 DSP56857BUE Datasheet Page 7 DSP56857BUE Datasheet Page 8 DSP56857BUE Datasheet Page 9 DSP56857BUE Datasheet Page 10 DSP56857BUE Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • DSP56857BUE Datasheet
  • where to find DSP56857BUE
  • NXP

  • NXP DSP56857BUE
  • DSP56857BUE PDF Datasheet
  • DSP56857BUE Stock

  • DSP56857BUE Pinout
  • Datasheet DSP56857BUE
  • DSP56857BUE Supplier

  • NXP Distributor
  • DSP56857BUE Price
  • DSP56857BUE Distributor

DSP56857BUE Specifications

ManufacturerNXP USA Inc.
Series568xx
Core Processor56800E
Core Size16-Bit
Speed120MHz
ConnectivitySCI, SPI, SSI
PeripheralsDMA, POR, WDT
Number of I/O47
Program Memory Size80KB (40K x 16)
Program Memory TypeSRAM
EEPROM Size-
RAM Size24K x 16
Voltage - Supply (Vcc/Vdd)1.62V ~ 1.98V
Data Converters-
Oscillator TypeExternal
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case100-LQFP
Supplier Device Package100-LQFP (14x14)

The Products You May Be Interested In

Manufacturer

NXP USA Inc.

Series

RS08

Core Processor

RS08

Core Size

8-Bit

Speed

10MHz

Connectivity

-

Peripherals

LVD, POR, WDT

Number of I/O

2

Program Memory Size

2KB (2K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

63 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

6-VDFN Exposed Pad

Supplier Device Package

6-DFN-EP (3x3)

Manufacturer

XMOS

Series

XS1

Core Processor

XCore

Core Size

32-Bit 16-Core

Speed

1000MIPS

Connectivity

Configurable

Peripherals

-

Number of I/O

90

Program Memory Size

128KB (32K x 32)

Program Memory Type

SRAM

EEPROM Size

-

RAM Size

-

Voltage - Supply (Vcc/Vdd)

0.90V ~ 5.5V

Data Converters

A/D 8x12b

Oscillator Type

Internal

Operating Temperature

0°C ~ 70°C (TA)

Mounting Type

Surface Mount

Package / Case

217-LFBGA

Supplier Device Package

217-FBGA (16x16)

Manufacturer

NXP USA Inc.

Series

HCS12

Core Processor

12V1

Core Size

16-Bit

Speed

25MHz

Connectivity

CANbus, IrDA, LINbus, SCI, SPI

Peripherals

LVD, POR, PWM, WDT

Number of I/O

54

Program Memory Size

240KB (240K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

11K x 8

Voltage - Supply (Vcc/Vdd)

3.13V ~ 5.5V

Data Converters

A/D 16x12b; D/A 2x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

64-LQFP

Supplier Device Package

64-LQFP (10x10)

PIC18F442-I/L

Microchip Technology

Manufacturer

Microchip Technology

Series

PIC® 18F

Core Processor

PIC

Core Size

8-Bit

Speed

40MHz

Connectivity

I²C, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, LVD, POR, PWM, WDT

Number of I/O

34

Program Memory Size

16KB (8K x 16)

Program Memory Type

FLASH

EEPROM Size

256 x 8

RAM Size

768 x 8

Voltage - Supply (Vcc/Vdd)

4.2V ~ 5.5V

Data Converters

A/D 8x10b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

44-LCC (J-Lead)

Supplier Device Package

44-PLCC (16.59x16.59)

Manufacturer

NXP USA Inc.

Series

HC12

Core Processor

CPU12

Core Size

16-Bit

Speed

8MHz

Connectivity

CANbus, MI Bus, SCI, SPI

Peripherals

POR, PWM, WDT

Number of I/O

68

Program Memory Size

60KB (60K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 16x8/10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

112-LQFP

Supplier Device Package

112-LQFP (20x20)

Recently Sold

DS1225AD-150IND

DS1225AD-150IND

Maxim Integrated

IC NVSRAM 64K PARALLEL 28EDIP

M30624FGPGP#U3C

M30624FGPGP#U3C

Renesas Electronics America

IC MCU 16BIT 256KB FLASH 100QFP

SMBJ10A

SMBJ10A

Taiwan Semiconductor Corporation

TVS DIODE 10V 17V DO214AA

IS42S16160G-7BLI-TR

IS42S16160G-7BLI-TR

ISSI, Integrated Silicon Solution Inc

IC DRAM 256M PARALLEL 54TFBGA

7A-8.000MBBK-T

7A-8.000MBBK-T

TXC

CRYSTAL 8.0000MHZ 20PF SMD

HCPL-0531-500E

HCPL-0531-500E

Broadcom

OPTOISO 3.75KV 2CH TRANS 8SOIC

LM2904AQTH-13

LM2904AQTH-13

Diodes Incorporated

IC OPAMP GP 2 CIRCUIT 8TSSOP

PDS1040-13

PDS1040-13

Diodes Incorporated

DIODE SCHOTTKY 40V 10A POWERDI5

VC060318A400RP

VC060318A400RP

VARISTOR 25.5V 30A 0603

4608X-101-102LF

4608X-101-102LF

Bourns

RES ARRAY 7 RES 1K OHM 8SIP

STW14NM50

STW14NM50

STMicroelectronics

MOSFET N-CH 550V 14A TO-247

LTST-C190KGKT

LTST-C190KGKT

Lite-On Inc.

LED GREEN CLEAR CHIP SMD