DSPIC33EP256MC506-H/MR
For Reference Only
| Part Number | DSPIC33EP256MC506-H/MR |
| PNEDA Part # | DSPIC33EP256MC506-H-MR |
| Description | IC MCU 16BIT 256KB FLASH 64QFN |
| Manufacturer | Microchip Technology |
| Unit Price | Request a Quote |
| In Stock | 3,312 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jul 2 - Jul 7 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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DSPIC33EP256MC506-H/MR Resources
| Brand | Microchip Technology |
| ECAD Module |
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| Mfr. Part Number | DSPIC33EP256MC506-H/MR |
| Category | Semiconductors › Embedded Processors & Controllers › Microcontrollers |
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- Delivery date: usually 2 to 7 working days.
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DSPIC33EP256MC506-H/MR Specifications
| Manufacturer | Microchip Technology |
| Series | Automotive, AEC-Q100, dsPIC™ 33EP |
| Core Processor | dsPIC |
| Core Size | 16-Bit |
| Speed | 60 MIPs |
| Connectivity | CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT |
| Number of I/O | 53 |
| Program Memory Size | 256KB (85.5K x 24) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 16K x 16 |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V |
| Data Converters | A/D 16x10b/12b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 150°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 64-VFQFN Exposed Pad |
| Supplier Device Package | 64-QFN (9x9) |
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Manufacturer Renesas Electronics America Series RX200 Core Processor RX Core Size 32-Bit Speed 50MHz Connectivity I²C, SCI, SPI Peripherals DMA, LVD, POR, PWM, WDT Number of I/O 64 Program Memory Size 384KB (384K x 8) Program Memory Type FLASH EEPROM Size 8K x 8 RAM Size 64K x 8 Voltage - Supply (Vcc/Vdd) 1.62V ~ 5.5V Data Converters A/D 14x12b; D/A 2x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 80-LQFP Supplier Device Package 80-LQFP (14x14) |
Manufacturer Cypress Semiconductor Corp Series F²MC-16LX MB90545G Core Processor F²MC-16LX Core Size 16-Bit Speed 16MHz Connectivity CANbus, EBI/EMI, SCI, Serial I/O, UART/USART Peripherals POR, WDT Number of I/O 81 Program Memory Size 128KB (128K x 8) Program Memory Type Mask ROM EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 3.5V ~ 5.5V Data Converters A/D 8x8/10b Oscillator Type External Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 100-BQFP Supplier Device Package 100-PQFP (14x20) |
Manufacturer XMOS Series XLF Core Processor XCore Core Size 32-Bit 10-Core Speed 2000MIPS Connectivity - Peripherals - Number of I/O 88 Program Memory Size 2MB (2M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 0.95V ~ 3.6V Data Converters - Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 128-TQFP Exposed Pad Supplier Device Package 128-TQFP (14x14) |
Manufacturer Cypress Semiconductor Corp Series PSOC® 4 CY8C42xx-L Core Processor ARM® Cortex®-M0 Core Size 32-Bit Speed 48MHz Connectivity CANbus, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT Number of I/O 98 Program Memory Size 256KB (256K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 32K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 5.5V Data Converters A/D 16x12b SAR; D/A 4x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 124-VFBGA Supplier Device Package 124-VFBGA (9x9) |
