DSPIC33FJ128GP306A-E/MR
For Reference Only
| Part Number | DSPIC33FJ128GP306A-E/MR |
| PNEDA Part # | DSPIC33FJ128GP306A-E-MR |
| Description | IC MCU 16BIT 128KB FLASH 64QFN |
| Manufacturer | Microchip Technology |
| Unit Price | Request a Quote |
| In Stock | 2,448 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 12 - May 17 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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DSPIC33FJ128GP306A-E/MR Resources
| Brand | Microchip Technology |
| ECAD Module |
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| Mfr. Part Number | DSPIC33FJ128GP306A-E/MR |
| Category | Semiconductors › Embedded Processors & Controllers › Microcontrollers |
Payment Method
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Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
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Notes
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DSPIC33FJ128GP306A-E/MR Specifications
| Manufacturer | Microchip Technology |
| Series | dsPIC™ 33F |
| Core Processor | dsPIC |
| Core Size | 16-Bit |
| Speed | 40 MIPs |
| Connectivity | I²C, IrDA, LINbus, SPI, UART/USART |
| Peripherals | AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Number of I/O | 53 |
| Program Memory Size | 128KB (128K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 16K x 8 |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V |
| Data Converters | A/D 18x10b/12b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 64-VFQFN Exposed Pad |
| Supplier Device Package | 64-QFN (9x9) |
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Manufacturer Renesas Electronics America Series H8® H8S/2300 Core Processor H8S/2000 Core Size 16-Bit Speed 25MHz Connectivity SCI, SmartCard Peripherals POR, PWM, WDT Number of I/O 70 Program Memory Size 512KB (512K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V Data Converters A/D 8x10b; D/A 2x8b Oscillator Type Internal Operating Temperature -20°C ~ 75°C (TA) Mounting Type Surface Mount Package / Case 113-TFLGA Supplier Device Package 113-TFLGA (8x8) |
Manufacturer Series Stellaris® ARM® Cortex®-M3S 9000 Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 80MHz Connectivity CANbus, Ethernet, I²C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 72 Program Memory Size 256KB (256K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 64K x 8 Voltage - Supply (Vcc/Vdd) 1.235V ~ 1.365V Data Converters A/D 16x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 108-LFBGA Supplier Device Package 108-BGA (10x10) |
