Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

EFM32GG330F1024G-E-QFN64

EFM32GG330F1024G-E-QFN64

For Reference Only

Part Number EFM32GG330F1024G-E-QFN64
PNEDA Part # EFM32GG330F1024G-E-QFN64
Description IC MCU 32BIT 1MB FLASH 64QFN
Manufacturer Silicon Labs
Unit Price Request a Quote
In Stock 8,784
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 22 - May 27 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

EFM32GG330F1024G-E-QFN64 Resources

Brand Silicon Labs
ECAD Module ECAD
Mfr. Part NumberEFM32GG330F1024G-E-QFN64
CategorySemiconductorsEmbedded Processors & ControllersMicrocontrollers
Datasheet
EFM32GG330F1024G-E-QFN64, EFM32GG330F1024G-E-QFN64 Datasheet (Total Pages: 433, Size: 5,340.11 KB)
PDFEFM32GG900F512G-D-D1I Datasheet Cover
EFM32GG900F512G-D-D1I Datasheet Page 2 EFM32GG900F512G-D-D1I Datasheet Page 3 EFM32GG900F512G-D-D1I Datasheet Page 4 EFM32GG900F512G-D-D1I Datasheet Page 5 EFM32GG900F512G-D-D1I Datasheet Page 6 EFM32GG900F512G-D-D1I Datasheet Page 7 EFM32GG900F512G-D-D1I Datasheet Page 8 EFM32GG900F512G-D-D1I Datasheet Page 9 EFM32GG900F512G-D-D1I Datasheet Page 10 EFM32GG900F512G-D-D1I Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • EFM32GG330F1024G-E-QFN64 Datasheet
  • where to find EFM32GG330F1024G-E-QFN64
  • Silicon Labs

  • Silicon Labs EFM32GG330F1024G-E-QFN64
  • EFM32GG330F1024G-E-QFN64 PDF Datasheet
  • EFM32GG330F1024G-E-QFN64 Stock

  • EFM32GG330F1024G-E-QFN64 Pinout
  • Datasheet EFM32GG330F1024G-E-QFN64
  • EFM32GG330F1024G-E-QFN64 Supplier

  • Silicon Labs Distributor
  • EFM32GG330F1024G-E-QFN64 Price
  • EFM32GG330F1024G-E-QFN64 Distributor

EFM32GG330F1024G-E-QFN64 Specifications

ManufacturerSilicon Labs
SeriesGiant Gecko
Core ProcessorARM® Cortex®-M3
Core Size32-Bit
Speed48MHz
ConnectivityI²C, IrDA, SmartCard, SPI, UART/USART, USB
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O52
Program Memory Size1MB (1M x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size128K x 8
Voltage - Supply (Vcc/Vdd)1.98V ~ 3.8V
Data ConvertersA/D 8x12b; D/A 2x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case64-VFQFN Exposed Pad
Supplier Device Package64-QFN (9x9)

The Products You May Be Interested In

Manufacturer

Zilog

Series

Z8® GP™

Core Processor

Z8

Core Size

8-Bit

Speed

8MHz

Connectivity

-

Peripherals

HLVD, POR, WDT

Number of I/O

24

Program Memory Size

4KB (4K x 8)

Program Memory Type

OTP

EEPROM Size

-

RAM Size

237 x 8

Voltage - Supply (Vcc/Vdd)

2V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

28-SOIC (0.295", 7.50mm Width)

Supplier Device Package

-

PIC18F65K22T-I/MR

Microchip Technology

Manufacturer

Microchip Technology

Series

PIC® XLP™ 18K

Core Processor

PIC

Core Size

8-Bit

Speed

64MHz

Connectivity

I²C, LINbus, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, LVD, POR, PWM, WDT

Number of I/O

53

Program Memory Size

32KB (16K x 16)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 5.5V

Data Converters

A/D 16x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

64-VFQFN Exposed Pad

Supplier Device Package

64-QFN (9x9)

LM3S2U93-IBZ80-A1T

Texas Instruments

Manufacturer

Series

Stellaris® ARM® Cortex®-M3S 2000

Core Processor

ARM® Cortex®-M3

Core Size

32-Bit

Speed

80MHz

Connectivity

CANbus, EBI/EMI, I²C, IrDA, Microwire, QEI, SPI, SSI, UART/USART

Peripherals

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT

Number of I/O

67

Program Memory Size

384KB (384K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

96K x 8

Voltage - Supply (Vcc/Vdd)

1.235V ~ 1.365V

Data Converters

A/D 16x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

108-LFBGA

Supplier Device Package

108-BGA (10x10)

Manufacturer

NXP USA Inc.

Series

HC08

Core Processor

HC08

Core Size

8-Bit

Speed

8MHz

Connectivity

-

Peripherals

LED, LVD, POR, PWM

Number of I/O

23

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 12x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Through Hole

Package / Case

28-DIP (0.600", 15.24mm)

Supplier Device Package

28-PDIP

Manufacturer

NXP USA Inc.

Series

Kinetis KE1xZ

Core Processor

ARM® Cortex®-M0+

Core Size

32-Bit

Speed

48MHz

Connectivity

I²C, SPI, UART/USART

Peripherals

DMA, LVD, POR, PWM, WDT

Number of I/O

38

Program Memory Size

64KB (64K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

2.7V ~ 5.5V

Data Converters

A/D 12x12b; D/A 1x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

44-LQFP

Supplier Device Package

44-LQFP (10x10)

Recently Sold

MADL-011021-14150T

MADL-011021-14150T

M/A-Com Technology Solutions

RF DIODE PIN 6TDFN

74FCT3807SOGI

74FCT3807SOGI

IDT, Integrated Device Technology

IC CLK BUFFER 1:10 100MHZ 20SOIC

11R472C

11R472C

Murata Power Solutions

FIXED IND 4.7UH 1.3A 90 MOHM TH

3224W-1-105E

3224W-1-105E

Bourns

TRIMMER 1M OHM 0.25W J LEAD TOP

MB95F698KPMC-G-SNE2

MB95F698KPMC-G-SNE2

Cypress Semiconductor

IC MCU 8BIT 60KB FLASH 48LQFP

DS1216C

DS1216C

Maxim Integrated

IC SMART/RAM 5V 64K/256K 28-DIP

2920L050DR

2920L050DR

Littelfuse

PTC RESET FUSE 60V 500MA 2920

74VHC125TTR

74VHC125TTR

STMicroelectronics

IC BUF NON-INVERT 5.5V 14TSSOP

T520B227M006ATE070

T520B227M006ATE070

KEMET

CAP TANT POLY 220UF 6.3V 3528

MAX8902BATA+T

MAX8902BATA+T

Maxim Integrated

IC REG LIN POS ADJ 500MA 8TDFN

IRF630NPBF

IRF630NPBF

Infineon Technologies

MOSFET N-CH 200V 9.3A TO-220AB

FQD3P50TM

FQD3P50TM

ON Semiconductor

MOSFET P-CH 500V 2.1A DPAK