EP1K30TI144-2
For Reference Only
| Part Number | EP1K30TI144-2 |
| PNEDA Part # | EP1K30TI144-2 |
| Description | IC FPGA 102 I/O 144TQFP |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 838 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 3 - May 8 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP1K30TI144-2 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP1K30TI144-2 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP1K30TI144-2 Specifications
| Manufacturer | Intel |
| Series | ACEX-1K® |
| Number of LABs/CLBs | 216 |
| Number of Logic Elements/Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of I/O | 102 |
| Number of Gates | 119000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 144-LQFP |
| Supplier Device Package | 144-TQFP (20x20) |
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Manufacturer Intel Series ACEX-1K® Number of LABs/CLBs 72 Number of Logic Elements/Cells 576 Total RAM Bits 12288 Number of I/O 136 Number of Gates 56000 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 256-BBGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Microsemi Corporation Series ProASIC3E Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 147 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 12084 Total RAM Bits 933888 Number of I/O 233 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature -55°C ~ 125°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 36864 Number of I/O 93 Number of Gates 250000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Microsemi Corporation Series ProASIC3 Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 97 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 144-LBGA Supplier Device Package 144-FPBGA (13x13) |
