EP20K30EFC256-2
For Reference Only
| Part Number | EP20K30EFC256-2 |
| PNEDA Part # | EP20K30EFC256-2 |
| Description | IC FPGA 256FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 4,752 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 12 - Jun 17 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP20K30EFC256-2 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP20K30EFC256-2 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP20K30EFC256-2 Specifications
| Manufacturer | Intel |
| Series | APEX-20KE® |
| Number of LABs/CLBs | 120 |
| Number of Logic Elements/Cells | 1200 |
| Total RAM Bits | 24576 |
| Number of I/O | - |
| Number of Gates | 113000 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
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Manufacturer Microsemi Corporation Series ProASIC3E Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 270 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
Manufacturer Microsemi Corporation Series ProASIC3E Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 516096 Number of I/O 341 Number of Gates 3000000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
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Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 784 Number of Logic Elements/Cells 1862 Total RAM Bits 25088 Number of I/O 192 Number of Gates 20000 Voltage - Supply 4.75V ~ 5.25V Mounting Type Through Hole Operating Temperature 0°C ~ 85°C (TJ) Package / Case 223-BCPGA Supplier Device Package 223-CPGA (47.25x47.25) |
