EP2AGX260FF35C4
For Reference Only
| Part Number | EP2AGX260FF35C4 |
| PNEDA Part # | EP2AGX260FF35C4 |
| Description | IC FPGA 612 I/O 1152FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 3,580 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 12 - Jun 17 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP2AGX260FF35C4 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2AGX260FF35C4 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2AGX260FF35C4 Specifications
| Manufacturer | Intel |
| Series | Arria II GX |
| Number of LABs/CLBs | 10260 |
| Number of Logic Elements/Cells | 244188 |
| Total RAM Bits | 12038144 |
| Number of I/O | 612 |
| Number of Gates | - |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
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Manufacturer Intel Series FLEX 6000 Number of LABs/CLBs 132 Number of Logic Elements/Cells 1320 Total RAM Bits - Number of I/O 81 Number of Gates 16000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 100-TQFP Supplier Device Package 100-TQFP (14x14) |
Manufacturer Xilinx Inc. Series Virtex®-II Number of LABs/CLBs 5760 Number of Logic Elements/Cells - Total RAM Bits 2211840 Number of I/O 912 Number of Gates 4000000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FCBGA (40x40) |
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Manufacturer Xilinx Inc. Series Virtex®-II Pro Number of LABs/CLBs 3424 Number of Logic Elements/Cells 30816 Total RAM Bits 2506752 Number of I/O 416 Number of Gates - Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
