EP2AGZ225FF35C3N
For Reference Only
| Part Number | EP2AGZ225FF35C3N |
| PNEDA Part # | EP2AGZ225FF35C3N |
| Description | IC FPGA 554 I/O 1152FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 5,958 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 13 - May 18 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP2AGZ225FF35C3N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2AGZ225FF35C3N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2AGZ225FF35C3N Specifications
| Manufacturer | Intel |
| Series | Arria II GZ |
| Number of LABs/CLBs | 8960 |
| Number of Logic Elements/Cells | 224000 |
| Total RAM Bits | 14248960 |
| Number of I/O | 554 |
| Number of Gates | - |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
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Manufacturer Xilinx Inc. Series Spartan®-7 Number of LABs/CLBs - Number of Logic Elements/Cells 6000 Total RAM Bits 184320 Number of I/O 100 Number of Gates - Voltage - Supply 0.95V ~ 1.05V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 225-LFBGA, CSPBGA Supplier Device Package 225-CSPBGA (13x13) |
Manufacturer Lattice Semiconductor Corporation Series MachXO Number of LABs/CLBs 32 Number of Logic Elements/Cells 256 Total RAM Bits - Number of I/O 78 Number of Gates - Voltage - Supply 1.71V ~ 3.465V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 100-LFBGA, CSPBGA Supplier Device Package 100-CSBGA (8x8) |
Manufacturer Intel Series ACEX-1K® Number of LABs/CLBs 360 Number of Logic Elements/Cells 2880 Total RAM Bits 40960 Number of I/O 249 Number of Gates 199000 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 484-BBGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 119 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 85°C (TA) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
