EP2AGZ300HF40I3N
For Reference Only
| Part Number | EP2AGZ300HF40I3N |
| PNEDA Part # | EP2AGZ300HF40I3N |
| Description | IC FPGA 734 I/O 1517FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 2,970 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 12 - Jun 17 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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EP2AGZ300HF40I3N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2AGZ300HF40I3N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2AGZ300HF40I3N Specifications
| Manufacturer | Intel |
| Series | Arria II GZ |
| Number of LABs/CLBs | 11920 |
| Number of Logic Elements/Cells | 298000 |
| Total RAM Bits | 18854912 |
| Number of I/O | 734 |
| Number of Gates | - |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FBGA (40x40) |
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Manufacturer Intel Series Stratix® IV GX Number of LABs/CLBs 9120 Number of Logic Elements/Cells 228000 Total RAM Bits 17544192 Number of I/O 564 Number of Gates - Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 1152-BBGA, FCBGA Supplier Device Package 1152-FBGA (35x35) |
Manufacturer Lattice Semiconductor Corporation Series MachXO3 Number of LABs/CLBs 1175 Number of Logic Elements/Cells 9400 Total RAM Bits 442368 Number of I/O 206 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LFBGA Supplier Device Package 256-CABGA (14x14) |
Manufacturer Microsemi Corporation Series SX-A Number of LABs/CLBs 6036 Number of Logic Elements/Cells - Total RAM Bits - Number of I/O 203 Number of Gates 108000 Voltage - Supply 2.25V ~ 5.25V Mounting Type Surface Mount Operating Temperature -55°C ~ 125°C (TC) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 95 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
