EP2SGX60EF1152C3
For Reference Only
| Part Number | EP2SGX60EF1152C3 |
| PNEDA Part # | EP2SGX60EF1152C3 |
| Description | IC FPGA 534 I/O 1152FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 6,462 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 27 - Jul 2 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP2SGX60EF1152C3 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2SGX60EF1152C3 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2SGX60EF1152C3 Specifications
| Manufacturer | Intel |
| Series | Stratix® II GX |
| Number of LABs/CLBs | 3022 |
| Number of Logic Elements/Cells | 60440 |
| Total RAM Bits | 2544192 |
| Number of I/O | 534 |
| Number of Gates | - |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
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Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 1024 Number of Logic Elements/Cells 2432 Total RAM Bits 32768 Number of I/O 256 Number of Gates 25000 Voltage - Supply 4.75V ~ 5.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 304-BFQFP Exposed Pad Supplier Device Package 304-PQFP (40x40) |
Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 86316 Total RAM Bits 2648064 Number of I/O 267 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
