EP3SE260F1517C2
For Reference Only
| Part Number | EP3SE260F1517C2 |
| PNEDA Part # | EP3SE260F1517C2 |
| Description | IC FPGA 976 I/O 1517FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 2,178 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 4 - May 9 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP3SE260F1517C2 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP3SE260F1517C2 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP3SE260F1517C2 Specifications
| Manufacturer | Intel |
| Series | Stratix® III E |
| Number of LABs/CLBs | 10200 |
| Number of Logic Elements/Cells | 255000 |
| Total RAM Bits | 16672768 |
| Number of I/O | 976 |
| Number of Gates | - |
| Voltage - Supply | 0.86V ~ 1.15V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FBGA (40x40) |
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Manufacturer Xilinx Inc. Series Virtex® UltraScale+™ Number of LABs/CLBs 75072 Number of Logic Elements/Cells 1313763 Total RAM Bits 190976000 Number of I/O 416 Number of Gates - Voltage - Supply 0.825V ~ 0.876V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 2104-BBGA, FCBGA Supplier Device Package 2104-FCBGA (47.5x47.5) |
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Manufacturer Lattice Semiconductor Corporation Series EC Number of LABs/CLBs - Number of Logic Elements/Cells 3100 Total RAM Bits 56320 Number of I/O 97 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Manufacturer Xilinx Inc. Series Virtex®-E Number of LABs/CLBs 2400 Number of Logic Elements/Cells 10800 Total RAM Bits 163840 Number of I/O 404 Number of Gates 569952 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
