EP3SL50F484C2
For Reference Only
| Part Number | EP3SL50F484C2 |
| PNEDA Part # | EP3SL50F484C2 |
| Description | IC FPGA 296 I/O 484FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 2,250 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 3 - May 8 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP3SL50F484C2 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP3SL50F484C2 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP3SL50F484C2 Specifications
| Manufacturer | Intel |
| Series | Stratix® III L |
| Number of LABs/CLBs | 1900 |
| Number of Logic Elements/Cells | 47500 |
| Total RAM Bits | 2184192 |
| Number of I/O | 296 |
| Number of Gates | - |
| Voltage - Supply | 0.86V ~ 1.15V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 484-BBGA, FCBGA |
| Supplier Device Package | 484-FBGA (23x23) |
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Manufacturer Xilinx Inc. Series Virtex® Number of LABs/CLBs 1176 Number of Logic Elements/Cells 5292 Total RAM Bits 57344 Number of I/O 260 Number of Gates 236666 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 352-LBGA Exposed Pad, Metal Supplier Device Package 352-MBGA (35x35) |
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Manufacturer Microsemi Corporation Series MX Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits - Number of I/O 140 Number of Gates 24000 Voltage - Supply 3V ~ 3.6V, 4.5V ~ 5.5V Mounting Type Surface Mount Operating Temperature -40°C ~ 85°C (TA) Package / Case 176-LQFP Supplier Device Package 176-TQFP (24x24) |
