EPF10K130EBC356-3
For Reference Only
| Part Number | EPF10K130EBC356-3 |
| PNEDA Part # | EPF10K130EBC356-3 |
| Description | IC FPGA 274 I/O 356BGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 4,014 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 5 - May 10 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EPF10K130EBC356-3 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EPF10K130EBC356-3 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EPF10K130EBC356-3 Specifications
| Manufacturer | Intel |
| Series | FLEX-10KE® |
| Number of LABs/CLBs | 832 |
| Number of Logic Elements/Cells | 6656 |
| Total RAM Bits | 65536 |
| Number of I/O | 274 |
| Number of Gates | 342000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 356-LBGA |
| Supplier Device Package | 356-BGA (35x35) |
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Manufacturer Lattice Semiconductor Corporation Series MachXO2 Number of LABs/CLBs 264 Number of Logic Elements/Cells 2112 Total RAM Bits 75776 Number of I/O 79 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 100-LQFP Supplier Device Package 100-TQFP (14x14) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 252 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
