EPF10K30AFC484-3
For Reference Only
| Part Number | EPF10K30AFC484-3 |
| PNEDA Part # | EPF10K30AFC484-3 |
| Description | IC FPGA 246 I/O 484FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 5,130 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 30 - May 5 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EPF10K30AFC484-3 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EPF10K30AFC484-3 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EPF10K30AFC484-3 Specifications
| Manufacturer | Intel |
| Series | FLEX-10KA® |
| Number of LABs/CLBs | 216 |
| Number of Logic Elements/Cells | 1728 |
| Total RAM Bits | 12288 |
| Number of I/O | 246 |
| Number of Gates | 69000 |
| Voltage - Supply | 3V ~ 3.6V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package / Case | 484-BBGA |
| Supplier Device Package | 484-FBGA (23x23) |
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Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 2304 Number of Logic Elements/Cells 5472 Total RAM Bits 73728 Number of I/O 384 Number of Gates 62000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
