F800BJHEPBTLT9
For Reference Only
| Part Number | F800BJHEPBTLT9 |
| PNEDA Part # | F800BJHEPBTLT9 |
| Description | IC FLASH 8M PARALLEL 48TSOP |
| Manufacturer | Sharp Microelectronics |
| Unit Price | Request a Quote |
| In Stock | 3,870 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 18 - Jun 23 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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F800BJHEPBTLT9 Resources
| Brand | Sharp Microelectronics |
| ECAD Module |
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| Mfr. Part Number | F800BJHEPBTLT9 |
| Category | Semiconductors › Memory ICs › Memory |
Payment Method
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- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
- Please confirm the specifications of the products when ordering.
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- Orders cannot be canceled after shipping the packages.
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F800BJHEPBTLT9 Specifications
| Manufacturer | Sharp Microelectronics |
| Series | - |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - Boot Block |
| Memory Size | 8Mb (1M x 8, 512K x 16) |
| Memory Interface | Parallel |
| Clock Frequency | - |
| Write Cycle Time - Word, Page | 90ns |
| Access Time | 90ns |
| Voltage - Supply | - |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.488", 12.40mm Width) |
| Supplier Device Package | 48-TSOP |
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Manufacturer Cypress Semiconductor Corp Series GL-S Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NOR Memory Size 2Gb (128M x 16) Memory Interface Parallel Clock Frequency - Write Cycle Time - Word, Page 60ns Access Time 120ns Voltage - Supply 2.7V ~ 3.6V Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case Die Supplier Device Package Wafer |
