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KMPC855TCZQ66D4

KMPC855TCZQ66D4

For Reference Only

Part Number KMPC855TCZQ66D4
PNEDA Part # KMPC855TCZQ66D4
Description IC MPU MPC8XX 66MHZ 357BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 3,852
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 3 - May 8 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

KMPC855TCZQ66D4 Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberKMPC855TCZQ66D4
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
KMPC855TCZQ66D4, KMPC855TCZQ66D4 Datasheet (Total Pages: 77, Size: 1,044 KB)
PDFMPC860SRZQ66D4R2 Datasheet Cover
MPC860SRZQ66D4R2 Datasheet Page 2 MPC860SRZQ66D4R2 Datasheet Page 3 MPC860SRZQ66D4R2 Datasheet Page 4 MPC860SRZQ66D4R2 Datasheet Page 5 MPC860SRZQ66D4R2 Datasheet Page 6 MPC860SRZQ66D4R2 Datasheet Page 7 MPC860SRZQ66D4R2 Datasheet Page 8 MPC860SRZQ66D4R2 Datasheet Page 9 MPC860SRZQ66D4R2 Datasheet Page 10 MPC860SRZQ66D4R2 Datasheet Page 11

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KMPC855TCZQ66D4 Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed66MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1), 10/100Mbps (1)
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature-40°C ~ 95°C (TA)
Security Features-
Package / Case357-BBGA
Supplier Device Package357-PBGA (25x25)

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STM32MP157CAC3T

STMicroelectronics

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STMicroelectronics

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Number of Cores/Bus Width

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SATA

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USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-40°C ~ 95°C (TC)

Security Features

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Number of Cores/Bus Width

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No

Display & Interface Controllers

-

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10/100/1000Mbps (2)

SATA

SATA 3Gbps (2)

USB

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Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

0°C ~ 125°C (TA)

Security Features

Cryptography, Random Number Generator

Package / Case

689-BBGA Exposed Pad

Supplier Device Package

689-TEPBGA II (31x31)

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