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L78IRD2A25DL

L78IRD2A25DL

For Reference Only

Part Number L78IRD2A25DL
PNEDA Part # L78IRD2A25DL
Description IC MCU 8-BIT 64K FLASH 40-DIP
Manufacturer Nuvoton Technology
Unit Price Request a Quote
In Stock 2,178
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 17 - Jun 22 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

L78IRD2A25DL Resources

Brand Nuvoton Technology
ECAD Module ECAD
Mfr. Part NumberL78IRD2A25DL
CategorySemiconductorsEmbedded Processors & ControllersMicrocontrollers

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L78IRD2A25DL Specifications

ManufacturerNuvoton Technology Corporation of America
Series-
Core Processor-
Core Size-
Speed-
Connectivity-
Peripherals-
Number of I/O-
Program Memory Size-
Program Memory Type-
EEPROM Size-
RAM Size-
Voltage - Supply (Vcc/Vdd)-
Data Converters-
Oscillator Type-
Operating Temperature-
Mounting Type-
Package / Case-
Supplier Device Package-

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Series

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Core Processor

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Core Size

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Speed

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Connectivity

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Peripherals

Brown-out Detect/Reset, DMA, POR, PWM, WDT

Number of I/O

29

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

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RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 12x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

32-VFQFN Exposed Pad

Supplier Device Package

32-HVQFN (5x5)

Manufacturer

NXP USA Inc.

Series

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Core Processor

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Core Size

32-Bit Dual-Core

Speed

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Connectivity

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Peripherals

DMA, POR, PWM, WDT

Number of I/O

-

Program Memory Size

1MB (1M x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 32x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

144-LQFP

Supplier Device Package

144-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

30

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

1K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

68-LCC (J-Lead)

Supplier Device Package

68-PLCC (24.21x24.21)

Manufacturer

NXP USA Inc.

Series

LPC900

Core Processor

8051

Core Size

8-Bit

Speed

18MHz

Connectivity

I²C, UART/USART

Peripherals

Brown-out Detect/Reset, LED, POR, PWM, WDT

Number of I/O

12

Program Memory Size

2KB (2K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 3.6V

Data Converters

A/D 4x8b; D/A 1x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

14-DIP (0.300", 7.62mm)

Supplier Device Package

14-DIP

MSP430F2272TRHARQ1

Texas Instruments

Manufacturer

Series

Automotive, AEC-Q100, MSP430F2

Core Processor

MSP430

Core Size

16-Bit

Speed

16MHz

Connectivity

I²C, IrDA, LINbus, SCI, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O

32

Program Memory Size

32KB (32K x 8 + 256B)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

1K x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 12x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

40-VFQFN Exposed Pad

Supplier Device Package

40-VQFN (6x6)

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