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LPC1113FHN33/302,5

LPC1113FHN33/302,5

For Reference Only

Part Number LPC1113FHN33/302,5
PNEDA Part # LPC1113FHN33-302-5_69
Description IC MCU 32BIT 24KB FLASH 32HVQFN
Manufacturer NXP
Unit Price Request a Quote
In Stock 4,086
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 19 - Jun 24 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

LPC1113FHN33/302 Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberLPC1113FHN33/302,5
CategorySemiconductorsEmbedded Processors & ControllersMicrocontrollers
Datasheet
LPC1113FHN33/302, LPC1113FHN33/302 Datasheet (Total Pages: 127, Size: 2,593 KB)
PDFLPC1114FN28/102 Datasheet Cover
LPC1114FN28/102 Datasheet Page 2 LPC1114FN28/102 Datasheet Page 3 LPC1114FN28/102 Datasheet Page 4 LPC1114FN28/102 Datasheet Page 5 LPC1114FN28/102 Datasheet Page 6 LPC1114FN28/102 Datasheet Page 7 LPC1114FN28/102 Datasheet Page 8 LPC1114FN28/102 Datasheet Page 9 LPC1114FN28/102 Datasheet Page 10 LPC1114FN28/102 Datasheet Page 11

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LPC1113FHN33/302 Specifications

ManufacturerNXP USA Inc.
SeriesLPC1100L
Core ProcessorARM® Cortex®-M0
Core Size32-Bit
Speed50MHz
ConnectivityI²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, WDT
Number of I/O28
Program Memory Size24KB (24K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size8K x 8
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V
Data ConvertersA/D 8x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case32-VQFN Exposed Pad
Supplier Device Package32-HVQFN (7x7)

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