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LPC802M001JHI33Y

LPC802M001JHI33Y

For Reference Only

Part Number LPC802M001JHI33Y
PNEDA Part # LPC802M001JHI33Y
Description IC MCU 32BIT 16KB FLASH 33HVQFN
Manufacturer NXP
Unit Price Request a Quote
In Stock 3,114
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 21 - May 26 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

LPC802M001JHI33Y Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberLPC802M001JHI33Y
CategorySemiconductorsEmbedded Processors & ControllersMicrocontrollers

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LPC802M001JHI33Y Specifications

ManufacturerNXP USA Inc.
SeriesLPC80xM
Core ProcessorARM® Cortex®-M0+
Core Size32-Bit
Speed15MHz
ConnectivityI²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Number of I/O17
Program Memory Size16KB (16K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size2K x 8
Voltage - Supply (Vcc/Vdd)1.71V ~ 3.6V
Data ConvertersA/D 12x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case32-VFQFN Exposed Pad
Supplier Device Package33-HVQFN (5x5)

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Series

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Core Processor

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Core Size

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Speed

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Connectivity

CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG

Peripherals

Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT

Number of I/O

83

Program Memory Size

768KB (768K x 8)

Program Memory Type

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EEPROM Size

16K x 8

RAM Size

136K x 8

Voltage - Supply (Vcc/Vdd)

2.2V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

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Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

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Supplier Device Package

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Microchip Technology

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Core Processor

dsPIC

Core Size

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Speed

180MHz, 200MHz

Connectivity

I²C, IrDA, LINbus, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT

Number of I/O

39

Program Memory Size

88KB (88K x 8)

Program Memory Type

FLASH, PRAM

EEPROM Size

-

RAM Size

20K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 3.6V

Data Converters

A/D 31x12b; D/A 4x12b

Oscillator Type

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Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

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Microchip Technology

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Series

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Core Processor

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Connectivity

I²C, IrDA, LINbus, PMP, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, DMA, POR, PWM, WDT

Number of I/O

85

Program Memory Size

128KB (128K x 8)

Program Memory Type

FLASH

EEPROM Size

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RAM Size

32K x 8

Voltage - Supply (Vcc/Vdd)

2.3V ~ 3.6V

Data Converters

A/D 28x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

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Package / Case

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32MHz

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LINbus, UART/USART

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O

12

Program Memory Size

7KB (4K x 14)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

2.3V ~ 5.5V

Data Converters

A/D 12x10b; D/A 1x5b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

Surface Mount

Package / Case

20-SSOP (0.209", 5.30mm Width)

Supplier Device Package

20-SSOP

DSPIC33EP64GP504T-E/TL

Microchip Technology

Manufacturer

Microchip Technology

Series

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Core Processor

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Core Size

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Speed

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Connectivity

CANbus, I²C, IrDA, LINbus, SPI, UART/USART

Peripherals

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Number of I/O

35

Program Memory Size

64KB (22K x 24)

Program Memory Type

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EEPROM Size

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RAM Size

4K x 16

Voltage - Supply (Vcc/Vdd)

3V ~ 3.6V

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Oscillator Type

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Operating Temperature

-40°C ~ 125°C (TA)

Mounting Type

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Package / Case

44-VFTLA Exposed Pad

Supplier Device Package

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