M1A3P1000-2FGG256I
For Reference Only
| Part Number | M1A3P1000-2FGG256I |
| PNEDA Part # | M1A3P1000-2FGG256I |
| Description | IC FPGA 177 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 3,942 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jul 24 - Jul 29 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1A3P1000-2FGG256I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1A3P1000-2FGG256I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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M1A3P1000-2FGG256I Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3 |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 147456 |
| Number of I/O | 177 |
| Number of Gates | 1000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Intel Series Cyclone® 10 LP Number of LABs/CLBs 963 Number of Logic Elements/Cells 15408 Total RAM Bits 516096 Number of I/O 162 Number of Gates - Voltage - Supply 1.2V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LFBGA Supplier Device Package 256-UBGA (14x14) |
Manufacturer Intel Series APEX-20KE® Number of LABs/CLBs 832 Number of Logic Elements/Cells 8320 Total RAM Bits 106496 Number of I/O 376 Number of Gates 526000 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BBGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Xilinx Inc. Series Virtex®-E Number of LABs/CLBs 6144 Number of Logic Elements/Cells 27648 Total RAM Bits 393216 Number of I/O 404 Number of Gates 1569178 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 560-LBGA Exposed Pad, Metal Supplier Device Package 560-MBGA (42.5x42.5) |
Manufacturer Intel Series Cyclone® II Number of LABs/CLBs 2076 Number of Logic Elements/Cells 33216 Total RAM Bits 483840 Number of I/O 322 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 252 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
