M1A3P1000L-FGG256
For Reference Only
| Part Number | M1A3P1000L-FGG256 |
| PNEDA Part # | M1A3P1000L-FGG256 |
| Description | IC FPGA 177 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 5,580 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 13 - Jun 18 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1A3P1000L-FGG256 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1A3P1000L-FGG256 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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M1A3P1000L-FGG256 Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3L |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 147456 |
| Number of I/O | 177 |
| Number of Gates | 1000000 |
| Voltage - Supply | 1.14V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Microsemi Corporation Series IGLOO2 Number of LABs/CLBs - Number of Logic Elements/Cells 6060 Total RAM Bits 719872 Number of I/O 209 Number of Gates - Voltage - Supply 1.14V ~ 2.625V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
Manufacturer Microsemi Corporation Series ProASIC3 Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 147456 Number of I/O 177 Number of Gates 1000000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
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Manufacturer Xilinx Inc. Series Virtex®-E Number of LABs/CLBs 6144 Number of Logic Elements/Cells 27648 Total RAM Bits 393216 Number of I/O 660 Number of Gates 1569178 Voltage - Supply 1.71V ~ 1.89V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 860-BGA Supplier Device Package 860-FBGA (42.5x42.5) |
