M1A3P600-1FGG256
For Reference Only
| Part Number | M1A3P600-1FGG256 |
| PNEDA Part # | M1A3P600-1FGG256 |
| Description | IC FPGA 177 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 6,804 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 19 - May 24 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1A3P600-1FGG256 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1A3P600-1FGG256 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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M1A3P600-1FGG256 Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3 |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 110592 |
| Number of I/O | 177 |
| Number of Gates | 600000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Lattice Semiconductor Corporation Series XP2 Number of LABs/CLBs 625 Number of Logic Elements/Cells 5000 Total RAM Bits 169984 Number of I/O 146 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
